The 24V 1200A PCB Copper Plating Rectifier offers 28.8 kW of adjustable DC power for printed circuit board copper deposition and related production lines.
The 24V 1200A PCB Copper Plating Rectifier supports controlled copper deposition for board and through-hole plating, where current distribution, agitation, chemistry and fixture design work together to influence thickness and via coverage.
Power control for PCB copper plating
PCB plating must distribute copper across surface features and through holes while meeting the required deposit thickness. Stable current control provides a repeatable electrical input for the plating cycle. Throwing power and thickness distribution also depend on bath chemistry, additives, agitation, panel geometry, anode arrangement and fixture contact.
Core specifications
| DC output | 24V, 1200A |
|---|---|
| Rated power | 28.8 kW |
| Regulation | Constant current and constant voltage |
| Cooling | Air or water cooling |
| Available functions | Timer, recipes, ampere-hour control, PLC and RS485 |
| Custom range | 1–1000V and 1–100,000A |
Selection starts with panel area
Determine amperage from the maximum simultaneous plated area and process current density. Confirm loaded voltage with the intended tank, anode spacing, cables and contacts. If pulse or periodic-reverse plating is required, provide the waveform, forward and reverse current, frequency and duty cycle.
Automation options
Recipes, ramped output, timed steps, production totals and remote control can connect the rectifier to a manual or automatic PCB line. Output data and alarms may also be collected by the factory control system.
See PCB copper plating rectifiers, browse DC rectifier solutions, or send your panel and waveform requirements.
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