Tin Plating – 12V 2500A Heavy-Duty IGBT Electroplating Rectifier

DELIVERING HIGH-PRECISION DC POWER FOR CONTINUOUS STRIP TINNING AND MATTE TIN PROCESSES, THIS 30KW SYSTEM IS ENGINEERED FOR AUTOMATED PCB AND ELECTRONIC COMPONENT MANUFACTURING LINES. THE UNIT BALANCES AGGRESSIVE CURRENT OUTPUT WITH LOW-RIPPLE PERFORMANCE TO MEET CRITICAL QUALITY STANDARDS.
PART 1: KEY FEATURES & ENGINEERING HIGHLIGHTS
This system utilizes advanced IGBT switching technology to convert 3-phase AC input (415V±10%) into stable, low-ripple DC output.
Ultra-Low Ripple & High Stability
Achieves less than 3% ripple factor, ensuring uniform deposition in matte tin and bright tin processes. This eliminates nodular growth and burning on high-density PCB busbar plating.
Precision Control Interface
Digital PID controller maintains output voltage within 0.5% accuracy. Supports real-time current regulation for complex PCB busbar plating profiles.
Heavy-Duty Construction
Drawer-type modular architecture with hot-swappable power modules. Isolated high-frequency transformer reduces copper losses by 18% compared to thyristor-based solutions.
Integrated Phase-Shift Cooling
Dual-fan forced air system with temperature sensors extends IGBT lifespan in demanding 24/7 production environments.
PART 2: TECHNICAL SPECIFICATIONS TABLE

PART 3: ADVANCED BUILT-IN PROTECTION SYSTEMS
The rectifier safeguard suite exceeds industry standards for industrial high frequency rectifier factory reliability. Protective mechanisms include:
Over-Voltage Protection (OVP) — Instant shutdown at 13.5V prevents cathode damage during strip tinning line interruptions.
Over-Current Protection (OCP) — Electronic trip at 2750A with auto-recovery after fault clearance.
Phase-Loss Detection — Independent monitoring for each input phase prevents single-phasing damage.
Over-Temperature Protection — Dual NTC sensors on each IGBT bank trigger forced shutdown at 85°C heatsink temperature.
Soft-Start Circuitry — 3-second ramp reduces inrush current below 120% of nominal for transformer and tank stability.
PART 4: TARGET INDUSTRIAL APPLICATIONS
Continuous Strip Tinning: Delivers stable 2500A current for high-speed tin coating on copper wire and busbars, maintaining uniform coating thickness at line speeds up to 30 m/min.
Matte Tin Process: Low-ripple output ensures consistent matte finish for electronic component leads and connectors, meeting IPC-4552 standards.
PCB Busbar Plating: Precise voltage control at 12V matches standard PCB rack configurations, enabling uniform deposition across large panels.
Reflow Tin Preparation: Preheating and plating stages benefit from the rectifier’s tight regulation, reducing reoxidation in automated lines.
PART 5: CUSTOMIZATION AND TAILORED ENGINEERING SERVICES
We operate as a IGBT rectifier manufacturer with full in-house design and prototyping capabilities. Standard units are configurable within these wide ranges:
Voltage / Current: 1V-1000V DC, 1A-100,000A DC
Input: Single-phase or three-phase AC, 208V to 600V (customer specified)
Output: DC only (standard)
Factory customization options include:
Process Timer — Programmable hold times for cycle automation in batch operations
Multi-Stage Profile Control — Up to 20-step current/voltage ramping for complex plating sequences (e.g., pre-tin, strike, build, pulse)
Ampere-Minute Integrator — Digital totalizer with remote data logging via RS485 Modbus RTU or Ethernet IP
Automatic Reverse Polarity — Programmable reversal cycles for deburring and activation steps
Pulse Functions — Adjustable 1-3000Hz square wave, duty cycle 1-99%, ideal for high-throw tin applications
4-20mA Analog Interface — Direct PLC compatibility for closed-loop thickness control
For pricing on a heavy-duty DC power supply price or a custom current voltage rectifier tailored to your tin plating line specifications, please contact our engineering team.